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 RF3334IF Low Noise Amplifier/Mixer
RF3334
IF LOW NOISE AMPLIFIER/MIXER
RoHS Compliant & Pb-Free Product Package Style: QFN, 16-Pin, 4 x 4
RFVCC
GND
LOB
Features
30dB RF Gain Control 40dB IF Gain Control 5dB Max. Noise Figure SSB LNA Input Internally Matched to 75 Single 5V Supply
RFIN 2 RFDEC 1
16
15
14
LO 13 12 RFAGC 11 MIXLOAD 10 MIXLOADB 9 GND 8 IFOUTB
GND 3
IF AMP
Applications
Cable Set Top Box General Purpose Downconverter Commercial and Consumer Systems
IFVCC 4 5 IFSET 6 IFSETB 7 IFOUT
Functional Block Diagram
Product Description
The RF3334 is an IF LNA/Mixer suitable for downconversion of forward channel control data in a set-top box application. It consists of a single-ended 75 terminated LNA, followed by a differential gain control stage with 30dB of analog gain control and a double-balanced mixer. The mixer load is available via pins 10 and 11 should an external filter be required. The mixer output is connected to an IF amplifier that can be configured from 10dB to 40dB gain with an external resistor. The amplifier is capable of 6V pk-pk output into a 1k load.
Ordering Information
RF3334 RF3334PCBA-41X LNA Mixer Fully Assembled Evaluation Board
Optimum Technology Matching(R) Applied
GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs pHEMT Si CMOS Si BJT GaN HEMT
RF MICRO DEVICES(R), RFMD(R), Optimum Technology Matching(R), Enabling Wireless ConnectivityTM, PowerStar(R), POLARISTM TOTAL RADIOTM and UltimateBlueTM are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. (c)2006, RF Micro Devices, Inc.
Rev A6 DS061016
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
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RF3334
Absolute Maximum Ratings Parameter
Supply Voltage IF Input Level Operating Ambient Temperature Storage Temperature
Rating
-0.5 to 7.0 500 -40 to +85 -40 to +150
Unit
VDC mVpp C C
Caution! ESD sensitive device.
Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice.
Parameter
DC Specifications
Supply Voltage Supply Current RFAGC Control Voltage RFAGC Input Impedance
Min.
4.75 20 0.5
Specification Typ.
5 24
Max.
5.25 4.5
Unit
V mA V k
Condition
0.5V=Minimum Gain 4.5V=Maximum Gain
300
AC Specifications LNA+AGC+Mixer
RF Frequency Range 0 to 700 MHz On-chip signal path is DC-coupled, minimum frequency depends on external AC coupling components. On-chip signal path is DC-coupled, minimum frequency depends on external AC coupling components. At 100MHz MHz dB dB dBV(rms) dBV(rms) dBV(rms) 5 dB Defined by on-chip first-order low-pass filter Differential At 100MHz RFAGC=4.5V RFAGC=0.5V Maximum Gain LNA Input to Mixer Output LNA Input to Mixer Output SSB, Cascaded LNA, AGC & Mixer
RF Input 3dB Bandwidth
700
MHz
RF Input Impedance RF Input VSWR Mixer Output 3dB Bandwidth Mixer Output Impedance Mixer Output VSWR Maximum Gain Minimum Gain Output 1dB Compression Input IP3, Maximum Gain Input IP3, Minimum Gain Noise Figure 27
75 1.4 100 300 1.2 30 -2 90 78 79
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7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS061016
RF3334
Parameter
LO
LO Frequency Range LO Input Impedance LO Input VSWR LO Input Level LO Bandwidth LO Rejection to RF Input LO Rejection to Input of IF Amplifier 80 800 50 65 0 to 800 75 1.6:1 dBuV MHz dB dB MHz Differential
Min.
Specification Typ.
Max.
Unit
Condition
IF Amplifier
IF Frequency Range Input Impedance Output Impedance Differential Voltage Gain Gain Set Resistor=2500 Gain Set Resistor=140 Gain Set Resistor=5 IF 3dB Bandwidth Equivalent Input Noise Output Swing Output 1dB Compression Output IP3 140 1.5 6 127 137 8 10 31 40 dB dB dB MHz Vrms VP-P dBV(rms) dBV(rms) R1=1k R1=1k R1=1k Gain Set=5 Gain Set=140 Into 1k load, at 50MHz Into 1k load, at 50MHz Into 1k load, at 50MHz VCC =5.25V, VRFAGC=4.5V, ICC =29mA, PDISS =154mW 65 95 C/W C TAMB =+85C 0 to 120 4000 10 MHz Differential Differential
Thermal
ThetaJC Maximum Measured Junction Temperature at DC Bias Conditions
Rev A6 DS061016
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
3 of 12
RF3334
Pin 1 Function RFDEC Description
External decoupling capacitor for RF single-ended to differential converter.
Interface Schematic
VCC
100
RFDEC
2
RF
LNA Input, Internally matched to 75. Should be AC-coupled.
VBIAS RF
3 4 5
GND IFVCC IFSET
Ground. 5V supply for IF section. IF Gain select. The resistance between this pin and pin 6 (IFSETB) determines the gain of the IF amplifier. Maximum gain is achieved by placing a short circuit between the pins. Larger values of resistance will reduce the IF gain according to the following equation where R is the value of resistance between pins 5 and 6. IFGain=20log(1600/(R=75))15. Complementary IF Gain select.
IFSET
IFSETB
6
IFSETB
IFSET
IFSETB
7
IFOUT
IF Amplifier Output. Differential output of the IF amplifier. The differential load across this pin and pin 8 (IFOUTB) should be 1k or greater for optimal performance. The differential output impedance across this pin and pin 8 in 10.
VBIAS
VCC
IF OUT
8
IFOUTB
Complementary IF Amplifier Output.
VCC
VBIAS
IF OUTB
9 10
GND MIXLOADB
Ground. Complementary Mixer load.
MIXLOAD MIXLOADB
11
MIXLOAD
Differential output of the RF mixer. A resonant load should be applied to this pin and pin 10 (MIXLOADB) that will act as a bandpass filter at the desired IF frequency. VCC should be supplied to this pin via an inductor or a resistor. Use of a resistor will degrade intermodulation performance.
MIXLOAD MIXLOADB
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7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS061016
RF3334
Pin 12 Function RFAGC Description
RF Gain select voltage input. The voltage applied to this pin sets the gain of the RF amplifier. The voltage applied to this pin should be between 0.5V and 4.5V. The RF gain characteristic is such that 0.5V yields a gain of -2dB and 4.5V yields a gain of +30dB as measured from the input of the LNA to the output of the mixer stage. Differential LO Input. This pin and pin 14 (LOB) are the differential LO inputs. This input should be AC-coupled. The differential input impedance across pins 13 and 14 is 75. The LO may be driven single ended but will require a higher drive level. If a single ended LO is applied, pin 14 should be AC-coupled to ground.
Interface Schematic
RFAGC 100 k 10 k VREF
13
LO
LOB 300 VBIAS 300 LO 75
14
LOB
Complementary LO Input. Should be AC-coupled.
LOB 300 VBIAS 300 LO 75
15 16 GND
GND RFVCC Paddle
Ground. 5V supply for RF section. Backside of package should be connected to ground.
Package Drawing
-A2 PLCS 0.10 C A 0.05 C
4.00 SQ . 2.00 TYP
0.10 C B 2 PLCS
0.70 0.65
0.90 0.85 0.05 0.00
12 M AX
0.10 C B 2 PLCS -B-
1.87 TYP 3.75 SQ
0.10 C A 2 PLCS
-C-
SEATING PLANE
Shaded lead is pin 1.
D im ensions in m m.
0.10 M C A B
0.60 0.24
TYP
0.35 0.23
Pin 1 ID 0.20 R
2.25 SQ . 1.95 0.75 TYP 0.50 0.65
Rev A6 DS061016
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
5 of 12
RF3334
Pin-Out
RFVCC GND LOB
16 RFDEC 1
15
14
LO 13 12 RFAGC 11 MIXLOAD 10 MIXLOADB 9 GND 8 IFOUTB
LO 10 nF
RFIN 2
GND 3
IFVCC 4 5 IFSET 6 IFSETB 7 IFOUT
10 nF
Application Schematic
LOB
VCC
1 k 10 nF
RFAGC
+
1 uF
1 nF
10 pF 16 15 14 13 12
C
10 nF 1 L RFIN 10 nF 3 VCC 4 10 n 5 6 7 8
IF AMP
2
11 R 10 C L VCC
9
IFOUT IFOUTB R*
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7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS061016
RF3334
Evaluation Board Schematic
T1
50 strip
J2 LO
TTWB-1-A
R1 1 k C4 10 nF
VCC + C1 1 uF C10 1 nF C2 10 nF 1 J3 RF IN 50 strip C3 10 nF C11 10 pF 16 15 14 13 12
RFAGC
C5 82 pF L1 120 nH R6 750 L2 120 nH C8 82 pF VCC
2
11
3
IF AMP
10
VCC C6 10 nF J1 J1-1 1 2 J1-3 3 CON3 VCC GND RF AGC
4 5 6 7 8
9
R3 475 R2 140 R4 475 R5 100
C7 10 n C9 10 n
J4 IFOUT J5 IFOUTB
Rev A6 DS061016
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
7 of 12
RF3334
Evaluation Board Layout
Board Size 2.0" x 2.0" Board Thickness 0.032", Board Material FR-4, Multi-layer
8 of 12
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS061016
RF3334
35.0
LNA + AGC + Mixer Gain versus Control Voltage over Temperature (Freq = 100 MHz, VCC = 5.0 V)
90.0 88.0 86.0
LNA + AGC + Mixer + IF AMP - IIP3 versus Gain over Temperature (Freq = 100 MHz, VCC = 5.0 V)
30.0
25.0 84.0
15.0
IIP3 (dBV)
20.0
Gain (dB)
82.0 80.0 78.0 76.0
10.0
5.0 -40C 0.0 +25C +85C -5.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 70.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 74.0 72.0 -40C +25C +85C
RFAGC (V)
Gain (dB)
35.0
SSB, Cascaded Noise Figure versus Gain over Temperature (Freq = 100 MHz, VCC = 5.0 V)
-40C +25C +85C
RF Input VSWR versus Frequency Across Temperature
1.40 1.38 1.36 1.34
(VCC = 5.0 V)
30.0
25.0
Noise Figure (dB)
RF Input VSWR
20.0
1.32 1.30 1.28 1.26 1.24 -40C +25C +85C
15.0
10.0
5.0 1.22 0.0 25.0 30.0 35.0 40.0 45.0 50.0 55.0 60.0 65.0 1.20 70.00 80.00 90.00 100.00 110.00 120.00
130.00
Gain (dB)
Frequency (MHz)
1.75
LO Input VSWR versus Temperature Across Temperature (VCC = 5.0 V)
1.70
LO Input VSWR
1.65
1.60
1.55
-40C +25C +85C
1.50 118.00 128.00 138.00 148.00 158.00 168.00 178.00
Frequency (MHz)
Rev A6 DS061016
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
9 of 12
RF3334
RF Input, Temp = +25C
0.6
Swp Max 0.2GHz
LO Input, Temp = +25C
0.6
Swp Max 0.2GHz
2.0
1.0
0.8
2. 0
0.8
0. 4
1.0
10.0
10.0
10.0
0.2
0.4
0.6
0.8
1.0
2.0
3.0 4.0 5.0
0.2
0.4
0.6
0.8
1.0
2.0
3.0
4.0 5.0
0
0
.4 -0
-0
.4
.0 -2
Swp Min 0.05GHz
-0. 6
-0.
.0 -2
6
Swp Min 0.05GHz
-0.8
-1.0
-0.8
10 of 12
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
-1.0
Rev A6 DS061016
-4. 0 -5.0
-3 .0
-4 . 0 -5.0
-0.2
0
-0.2
-10.0
0.2
-10.0
-3 .
0.
4
3.0
3.0
4.0 5.0
4.0 5. 0
10.0
0.2
RF3334
PCB Design Requirements
PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Pattern
A = 0.69 x 0.28 (mm) Typ. B = 0.28 x 0.69 (mm) Typ. C = 2.40 (mm) Sq.
Dimensions in mm.
1.95 Typ. 0.65 Typ.
Pin 16 B Pin 1 A A C A A A A B B B B Pin 8 B B B Pin 12 A A
0.65 Typ.
0.98 1.95 Typ.
0.81 Typ.
0.81 Typ. 0.98
Figure 1. PCB Metal Land Pattern (Top View)
Rev A6 DS061016
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
11 of 12
RF3334
PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier.
A = 0.79 x 0.38 (mm) Typ. B = 0.38 x 0.79 (mm) Typ. C = 2.50 (mm) Sq.
Dimensions in mm.
1.95 Typ. 0.65 Typ.
Pin 16 B Pin 1 A A C A A A A B B B B Pin 8 B B B Pin 12 A A
0.65 Typ.
0.98 1.95 Typ.
0.81 Typ.
0.81 Typ. 0.98
Figure 2. PCB Solder Mask Pattern (Top View) Thermal Pad and Via Design The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results.
12 of 12
7628 Thorndike Road, Greensboro, NC 27409-9421 * For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A6 DS061016


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